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Defect Inspection Equipmentの製品一覧

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Wafer Surface Defect Inspection Device "MO-601HS"

Fully automatic measurement with an auto-loader! Wafer surface defect inspection equipment.

The "MO-601HS" is a wafer surface defect inspection device that enables measurement across the entire wafer, allowing for the identification of crystal defects near the active layer of Si wafers as foreign substances and surface roughness or scratches on the surface. It is possible to confirm defects with actual images through the viewer function, as well as analyze defects through TEM observation using the laser marking function. As a method for non-destructive evaluation of the breakdown voltage and reliability of oxide films, it is utilized for maintaining the quality of annealed wafers and others. 【Features】 ■ Fully automated measurement with an auto-loader ■ Compatible with 200mm and 300mm wafers ■ High sensitivity: capable of detecting defects as small as 200nm in diameter ■ Full mapping measurement function for defects, foreign substances, and haze ■ Raster scan method with constant measurement conditions *For more details, please refer to the catalog or feel free to contact us.

  • Other inspection equipment and devices

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Edge Defect Inspection Device "RXW Series"

Unique laser application technology and sensor/image processing technology! Equipment dedicated to silicon wafers.

The "RXW Series" is a dedicated edge defect inspection device for silicon wafers that utilizes unique laser application technology along with sensor and image processing technology. It meets the diverse inspection, dimensional measurement, and automatic sorting requirements for edge proximity areas demanded in both wafer manufacturing and device manufacturing processes. We offer models such as the "RXW-1200D" and "RXW-1200F" that are compatible with device manufacturing processes. 【Features】 <RXW-1200D> ■ Full circumference image acquisition and ADC functionality using a laser sensor ■ Dark field switching function that enables high-sensitivity inspection ■ Border measurement function after EBR ■ Inspection and measurement after edge trimming, bonding, and sintering in CIS/TSV processes ■ ADR function with a high-magnification AF color camera *For more details, please refer to the PDF document or feel free to contact us.

  • Other inspection equipment and devices

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ブックマークを削除いたしました

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